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XCKU095-2FFVB1760E

Name: AMD XCKU095-2FFVB1760E
Brand: AMD / Xilinx
SKU: 217-KU095-2FFVB1760E
Price: 9643.84 USD
Availability: OutOfStock

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Mouser No:

217-KU095-2FFVB1760E

Mfr. No:

XCKU095-2FFVB1760E

Mfr.:

AMD / Xilinx

Description:

FPGA - Field Programmable Gate Array XCKU095-2FFVB1760E

Datasheet:

XCKU095-2FFVB1760E Datasheet (PDF)

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Factory Lead Time:: 31 Weeks Estimated factory production time.

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Qty.	Unit Price	Ext. Price
	$9,643.84	$9,643.84

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AMD
Product Category:	FPGA - Field Programmable Gate Array
Delivery Restrictions:	This product may require additional documentation to export from the United States.
RoHS:
Series:	XCKU095
Number of Logic Elements:	1176000 LE
Adaptive Logic Modules - ALMs:	67200 ALM
Embedded Memory:	59.1 Mbit
Number of I/Os:	750 I/O
Supply Voltage - Min:	850 mV
Supply Voltage - Max:	850 mV
Minimum Operating Temperature:	0 C
Maximum Operating Temperature:	+ 100 C
Data Rate:	16.3 Gb/s
Number of Transceivers:	64 Transceiver
Mounting Style:	SMD/SMT
Package/Case:	FBGA-1760
Brand:	AMD / Xilinx
Distributed RAM:	4.7 Mbit
Embedded Block RAM - EBR:	59.1 Mbit
Moisture Sensitive:	Yes
Number of Logic Array Blocks - LABs:	67200 LAB
Operating Supply Voltage:	850 mV
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	12
Subcategory:	Programmable Logic ICs
Tradename:	Kintex UltraScale

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Datasheet

XCKU095-2FFVB1760E Datasheet (PDF)

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USHTS:: 8542310060
TARIC:: 8542399000
ECCN:: 3A001.a.7.b

Kintex™ UltraScale+™ FPGAs

AMD / Xilinx Kintex™ UltraScale+™ Field Programmable Gate Arrays (FPGAs) feature the highest signal processing bandwidth in mid-range, next-generation transceivers. AMD / Xilinx Kintex UltraScale+ FPGAs are available for packet processing in 100G networking and data center applications. The FPGAs are also ideal for DSP-intensive processing needed in next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure. Kintex UltraScale+ FPGAs are optimized for system performance and integration at 20nm and enabled by monolithic and next-generation stacked silicon interconnect (SSI) technology.