ATS-61330W-C2-R0

Name: Advanced Thermal Solutions ATS-61330W-C2-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-61330W-C2-R0
Price: 18.95 USD
Availability: OutOfStock

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Mouser No:

984-ATS-61330W-C2-R0

Mfr. No:

ATS-61330W-C2-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA fanSINK w/maxiGRIP Attachment, T412, Fan Sold Separately, 32.25x32.25x24.5mm

Datasheet:

ATS-61330W-C2-R0 Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS-61330W-C2-R0

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Fan Sink Assemblies
Designed for:	BGA
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	1.55 C/W
Length:	32.25 mm
Width:	32.25 mm
Height:	24.5 mm
Type:	Component
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-61
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	fanSINK maxiGRIP

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Datasheet

ATS-61330W-C2-R0 Datasheet (PDF)

Images

Application Examples

Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

Videos

ATS fanSINK Heat Sink Family Overview

Compliance Codes

USHTS:: 7616995190
MXHTS:: 7616995195
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

fanSINK™ High Performance Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) fanSINK™ High-Performance Heat Sinks feature a cross-cut straight-fin structure that allows for omnidirectional airflow for optimal thermal performance independent of the PCB layout. Depending on their size, the fanSINK can be securely clipped onto a device with the ATS maxiGRIP™ attachment system or by using standoff and spring hardware for direct attachment to the PCB. The stainless-steel screw fan attachment ensures a dependable long-term fan-to-heat sink connection (fan not included). These heat sinks include pre-assembled thermal interface material (TIM) centered on the base to ensure proper thermal transfer between the component and heat sink.