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ATS025025009-PF015

Name: Advanced Thermal Solutions ATS025025009-PF015
Brand: Advanced Thermal Solutions
SKU: 984-AT025025009PF015
Price: 3.11 USD
Availability: InStock

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Mouser No:

984-AT025025009PF015

Mfr. No:

ATS025025009-PF015

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 25x25x8.9mm (LxWxH)

Datasheet:

ATS025025009-PF015 Datasheet (PDF)

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Omnidirectional Fin
Thermal Resistance:	13.5 C/W
Length:	25 mm
Width:	25 mm
Height:	8.9 mm
Type:	Component
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform

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Datasheet

ATS025025009-PF015 Datasheet (PDF)

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Compliance Codes

USHTS:: 7616995190
JPHTS:: 761699000
BRHTS:: 76169900
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.