IT3D-200S-BGA(39)

Hirose Connector
798-IT3D200SBGA39
IT3D-200S-BGA(39)

Mfr.:

Description:
Board to Board & Mezzanine Connectors

Datasheet:
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Learn more about Hirose Connector IT3D-200S-BGA(39)

Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
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Ext. Price:
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Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$26.07 $26.07
$20.29 $202.90
$20.28 $486.72
$20.04 $2,404.80
$19.61 $5,177.04
$19.47 $9,812.88
2,520 Quote

Product Attribute Attribute Value Select Attribute
Hirose Electric
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
200 Position
1.5 mm (0.059 in)
Solder Balls
Straight
39 mm
1 A
50 V
10 Gbps
- 55 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
IT3
Tray
Brand: Hirose Connector
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 24
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 636-0003-8-39
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Attributes selected: 0

Datasheet

PCN

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USHTS:
8536694040

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.

IT3 High-Speed BGA Mezz Connectors

Hirose IT3 High-Speed BGA Mezz Connectors transmit differential, single-ended, and power through one package. The stackable IT3 series (ranging from 15mm to 40mm) provides reliable connections for today's data rates, including PCIe and XAUI, as well as 10+ Gbps systems. Hirose IT3 High-Speed BGA Mezz Connectors offer a staggered 1.5mm x 1.75mm ball grid array. Additional features include 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability. The IT3 system features three basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB, and different height interposer assemblies are selected to achieve the needed height between the PCBs.

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