FS660R08A6P2FBBPSA1

Infineon Technologies
726-FS660R08A6P2FBBP
FS660R08A6P2FBBPSA1

Mfr.:

Description:
IGBT Modules HYBRID PACK DRIVE G1 SI

ECAD Model:
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In Stock: 9

Stock:
9 Can Dispatch Immediately
Factory Lead Time:
26 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$317.23 $317.23

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: IGBT Modules
RoHS:  
Hybrid IGBT Modules
6-Pack
750 V
1.1 V
450 A
400 nA
1.053 kW
- 40 C
+ 150 C
Tray
Brand: Infineon Technologies
Maximum Gate Emitter Voltage: 20 V
Mounting Style: Screw Mount
Product Type: IGBT Modules
Series: IGBT EDT2
Factory Pack Quantity: 6
Subcategory: IGBTs
Technology: Si
Tradename: HybridPACK
Part # Aliases: FS660R08A6P2FB SP001632426
Unit Weight: 600 g
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CNHTS:
8504409100
USHTS:
8541290065
TARIC:
8541290000
ECCN:
EAR99

Automotive HybridPACK™ IGBT Modules

Infineon Technologies Automotive HybridPACK™ IGBT Modules extend across the full power spectrum required in electric and hybrid electric vehicles (EVs/HEVs). These compact modules are available in six RoHS-compliant versions with three base plate options: copper, direct cooled with ribbon bonds, and direct cooled with pin fins. The modules offer an integrated NTC temperature sensor, PressFIT contact technology, and guiding elements for easy PCB and cooler assembly. Other features include high creepage and clearance distances, high power density, and low switching losses. Applications for Infineon Automotive HybridPACK IGBT Modules include EVs, HEVs, motor drives, and commercial agriculture vehicles.

750V HybridPACK™ Drive Modules

Infineon Technologies 750V HybridPACK™ Drive Modules are compact power modules optimized for hybrid and electric vehicle main inverter applications (xEV). The HybridPACK modules come with mechanical guiding elements, supporting easy assembly processes. The press-fit pins for the signal terminals avoid time-consuming selective solder processes, which provide cost savings on a system level and increase system reliability.