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171574-1814

Name: Molex 171574-1814
Brand: Molex
SKU: 538-171574-1814
Price: 60.3 USD
Availability: OutOfStock

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Mouser No:

538-171574-1814

Mfr. No:

171574-1814

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact 100 Ohm 4 Pair R/A Orthogonal Direct Header, Unguided, Dual Endwall, w/ Outrigger, 8 Column, 90 Mate Pos., Pin Lg. 4.9mm, Plated Through-Hole Dimension 0.46mm, Lead-Free

Datasheet:

171574-1814 Datasheet

ECAD Model:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Number of Positions:	96 Position
Number of Rows:	12 Row
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	171574
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Current Rating:	750 mA
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	100
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	30 V
Unit Weight:	20.134 g

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Datasheet

171574-1814 Datasheet

Images

3D Adobe Image PDF (PDF)

Models

PCN

Manufacturing Process Change (PDF)

RoHS Certificate (PDF)

Compliance Codes

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Singapore
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.