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76495-1127

Name: Molex 76495-1127
Brand: Molex
SKU: 538-76495-1127
Price: 22.92 USD
Availability: OutOfStock

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Mouser No:

538-76495-1127

Mfr. No:

76495-1127

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact 85 Ohm Plus 4 Pair RAM Sig Module, Unguided, Dual Endwalls, 10 Columns, 120 Pos., Pin Lg. 4.9mm, Plated TH Dimension 0.39mm, Lead Free

Datasheet:

76495-1127 Datasheet

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	120 Position
Number of Rows:	12 Row
Pitch:	1.9 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	76495
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Current Rating:	750 mA
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	180
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	30 V
Unit Weight:	14.501 g

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Datasheet

76495-1127 Datasheet

PCN

Change Construction Or Material (PDF)

RoHS Certificate (PDF)

Compliance Codes

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.