APF6-020-03.5-S-04-2-TR

Samtec
200-APF6020035S042TR
APF6-020-03.5-S-04-2-TR

Mfr.:

Description:
Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket

Datasheet:
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Learn more about Samtec APF6-020-03.5-S-04-2-TR

Availability

Stock:
Non-Stocked
Factory Lead Time:
1 Week Estimated factory production time.
Minimum: 650   Multiples: 650
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 650)
$10.53 $6,844.50

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Board to Board & Mezzanine Connectors
Sockets
80 Position
0.635 mm (0.025 in)
4 Row
Solder Balls
Straight
1.34 A
155 VAC
56 Gbps
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
APF6
Reel
Brand: Samtec
Data Rate: 56 Gbps
Mounting Style: SMD/SMT
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 650
Subcategory: Board to Board & Mezzanine Connectors
Tradename: Accelerate HP
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Attributes selected: 0

Datasheet

Images

Specification Sheets

Technical Resources

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay® Extreme Performance (EP) and AcceleRate® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

APF6 & APM6 AcceleRate® High-Performance Terminals

Samtec APF6 and APM6 AcceleRate® High-Performance Terminals are 0.635mm pitch interconnects featuring 112Gbps PAM4 extreme performance and a flexible open-pin-field design. The APF6 and APM6 AcceleRate Terminals have a high-density 4-row design, with 10 to 100 positions in each row. These devices are ideal for space-constrained applications, with a low-profile 5mm height and a slim 5mm width.  

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