HDTM-3-08-1-S-VT-5-R-1

Samtec
200-HDTM3081SVT5R1
HDTM-3-08-1-S-VT-5-R-1

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$12.71 $12.71
$11.47 $114.70
$10.21 $255.25
$8.34 $700.56
$7.70 $1,940.40

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Tray
Brand: Samtec
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 42
Subcategory: Backplane Connectors
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Attributes selected: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.