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HPTT-3-S-6-6-D-RA

Name: Samtec HPTT-3-S-6-6-D-RA
Brand: Samtec
SKU: 200-HPTT3S66DRA
Price: 12.78 USD
Availability: InStock

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Mouser No:

200-HPTT3S66DRA

Mfr. No:

HPTT-3-S-6-6-D-RA

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede HD Power Module

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HPTT-3-S-6-6-D-RA Datasheet (PDF)

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More Information

Learn more about Samtec HPTT-3-S-6-6-D-RA

In Stock: 53

Stock:: 53 Can Dispatch Immediately

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Factory Lead Time:: 2 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$12.78	$12.78
	$12.27	$306.75
	$11.78	$647.90
	$10.96	$1,205.60
	$10.12	$2,783.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Product:	Power Modules
Number of Positions:	12 Position
Number of Rows:	2 Row
Pitch:	1.5 mm
Termination Style:	Press-Fit
Contact Plating:	Gold
Series:	HPTT
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Housing Colour:	Black
Housing Material:	Polyphenylene Sulfide (PPS)
Mounting Angle:	Right Angle
Orientation:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	55
Subcategory:	Backplane Connectors

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Datasheet

HPTT-3-S-6-6-D-RA Datasheet (PDF)

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USHTS:: 8536694040
ECCN:: EAR99

HPTT XCede® HD Power Modules

Samtec HPTT XCede^® HD Power Modules offer a 1.8mm pitch and a small form factor for significant space savings. These modules are a high-performance system with up to 84 differential pairs per linear inch. HPTT XCede modules allow users to combine any configuration of modules to create one integrated receptacle. Specifications for the HPTT XCede Modules from Samtec include 85Ω and 100Ω options, copper alloy contact material, 10A current rating per blade, and an operating temperature range of -40°C to +105°C. Samtec HPTT XCede HD Power Modules mate with the HPTS series and offer 3-, 4-, and 6-pair designs on 4, 6, and 8 columns.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.