XR-C452-0404D

Quantic X-Microwave
433-XR-C452-0404D
XR-C452-0404D

Mfr.:

Description:
RF Development Tools Band Pass Filter, B100MC5S [PCB: 1506]

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Learn more about Quantic X-Microwave XR-C452-0404D

In Stock: 3

Stock:
3 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$284.75 $284.75

Product Attribute Attribute Value Select Attribute
Quantic X-Microwave
Product Category: RF Development Tools
RoHS:  
Bandpass Filters
Band Pass Filter
Brand: Quantic X-Microwave
Packaging: Poly Bags
Product Type: RF Development Tools
Series: C452
Factory Pack Quantity: 1
Subcategory: Development Tools
Tradename: X-MWblock
Part # Aliases: B100MC5S
Unit Weight: 2.835 g
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Product Overview

CAHTS:
8548000000
USHTS:
9030890100
JPHTS:
854800000
KRHTS:
9030890000
TARIC:
9030890000
ECCN:
EAR99

Diplexers & Filters

Quantic X-Microwave Diplexers and Filters provide RF and microwave industry modular design technology. The Quantic X-Microwave Diplexers and Filters use X-MWblock® modular building blocks, so engineers can quickly prototype and build efficient, cost-effective systems. Applications include wireless infrastructure, radar, navigation, transportation, quantum computing, medical devices, and test/measurement. These solutions support components from manufacturers like Akoustis, Analog Devices, Atlanta Micro, CTS, Knowles/DLI, Kyocera AVX, Marki Microwave, Microchip/Vectron, Mini-Circuits, Qorvo, Quantic X-Microwave, and TDK.

Get On The Grid

Quantic X-Microwave Get On The Grid is part of the X-Microwave System for RF and Microwave design. X-MWblocks revolutionize RF signal chain optimization with drop-in flexibility, negating the need for soldering or cumbersome evaluation board connections. These blocks are complemented by programming tools like the Raspberry Pi Controller, streamlining the design process. The X-MWblocks can be effortlessly moved from prototype plates into standard or custom connectorized housings, eliminating the need for solderless interconnects. The devices can be incorporated into a single PCB for more integrated solutions, replacing spring pins with soldered wires. Miniaturization is also an option, ensuring compatibility with other grid modules.

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