EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.

Types of Discrete Semiconductors
Change category view
Results: 9
Select Image Part #
 Mfr.
Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product Type
Technology
Mounting Style
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Datasheet
33In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datasheet
16In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
Datasheet
45In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datasheet
30In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Datasheet
3In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Datasheet
23In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Datasheet
33In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Discrete Semiconductor Modules EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC
Datasheet
6In Stock
24On Order
Min.: 1
Mult.: 1

Discrete Semiconductor Modules SiC Press Fit
Infineon Technologies MOSFET Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Datasheet
15In Stock
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit