Thermal Bridge Technology for I/O Applications

TE Connectivity's (TE) Thermal Bridge Technology for Input/Output (I/O) Applications is a mechanical alternative to traditional gap pads or thermal interface materials. Thermal Bridge Technology offers superior thermal resistance while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features improved thermal resistance, better reliability and durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/wireless, servers, Ethernet SP routing, and high-performance computing (HPC) applications. 

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TE Connectivity I/O Connectors CAGE ASSY,SFP-DD 1X1 THERMAL BRIDGE
Datasheet
448In Stock
Min.: 1
Mult.: 1

Cage Assemblies 40 Position Through Hole Press Fit Right Angle
TE Connectivity I/O Connectors SFP+ 1x1 Cage Assy Thermal Bridge
Datasheet
157In Stock
384Expected 2026/04/27
Min.: 1
Mult.: 1

Cage Assemblies Female 20 Position 14.25 mm Through Hole Press Fit Right Angle - 55 C + 85 C
TE Connectivity I/O Connectors CAGE ASSEMBLY QSFP28 1X1 THERMAL
Datasheet
241Expected 2026/03/05
Min.: 1
Mult.: 1
Cages Female 38 Position 19 mm Press Fit Solder Pin Straight - 40 C + 85 C
TE Connectivity I/O Connectors CAGE ASSEMBLY QSFP-DD 1X1, SPRING
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 896
Mult.: 896

Cages Female 76 Position 19 mm Panel Mount Straight - 55 C + 85 C
TE Connectivity I/O Connectors CAGE ASSEMBLY 1X4 QSFP28 TB
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 50,004
Mult.: 50,004

Cage Assemblies Female Tin Through Hole Press Fit Right Angle - 40 C + 85 C