kp27f Board to Board & Mezzanine Connectors

Results: 4
Select Image Part # Mfr. Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Stack Height Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series Packaging
Hirose Connector Board to Board & Mezzanine Connectors Non-Stocked Lead-Time 16 Weeks
Min.: 240
Mult.: 240
Headers 174 Position 0.5 mm (0.02 in) 2 Row Solder Straight 21 mm 500 mA, 3 A 50 VAC, 200 VAC 8 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) KP27F Tray
Hirose Connector Board to Board & Mezzanine Connectors Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
Receptacles 174 Position 0.5 mm (0.02 in) 2 Row Solder Straight 21 mm 500 mA, 3 A 50 VAC, 200 VAC 8 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) KP27F Tray
Hirose Connector Board to Board & Mezzanine Connectors Non-Stocked
Min.: 750
Mult.: 750
Receptacles 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 21 mm 500 mA, 3 A 50 VAC, 200 VAC 8 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) KP27F Tray
Hirose Connector Board to Board & Mezzanine Connectors Non-Stocked
Min.: 400
Mult.: 400
Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 21 mm 500 mA, 3 A 50 VAC, 200 VAC 8 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) KP27F Tray