1 Channel Multiprotocol Modules

Results: 24
Select Image Part # Mfr. Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - WiFi - 802.11 Packaging
Advantech Multiprotocol Modules 802.11ax+BT5.3, NXP 88W9098, PCIe-UART, 215In Stock
Min.: 1
Mult.: 1
AIW-165 2.4 GHz, 5 GHz UART 3.3 V 3.3 V - 40 C + 85 C Without Antenna 28 mm x 30 mm x 3.95 mm Bluetooth 5.3
Advantech Multiprotocol Modules AX210 6E 802.11ax+BT5.2 vpo module+anten 290In Stock
Min.: 1
Mult.: 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Digi Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, No SIM 716In Stock
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, No SIM 517In Stock
1,375Expected 2026/07/10
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, AT&T SIM 28In Stock
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Advantech Multiprotocol Modules AX210 6E 802.11ax+BT5.2 module+antenna+c 174In Stock
Min.: 1
Mult.: 1
AIW-166K 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.3 V 3.3 V 0 C + 70 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2
Murata Electronics Multiprotocol Modules Type 2GF Shielded Small Wi-Fi 11a/b/g/n/ac Dual-band SISO + Bluetooth 5.4 Module 99In Stock
Min.: 1
Mult.: 1
: 1,000

2GF 2.412 GHz to 5.825 GHz UART 3.2 V 4.6 V - 20 C + 70 C 7 Channel 10 mm x 7.2 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac Reel, Cut Tape
NXP Semiconductors Multiprotocol Modules IW611HN/A1C
25Expected 2026/08/21
Min.: 1
Mult.: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
NXP Semiconductors Multiprotocol Modules IW612HN/A1I
100Expected 2026/08/21
Min.: 1
Mult.: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel, Cut Tape
Renesas / Dialog Multiprotocol Modules Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, PCB trace antenna Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog Multiprotocol Modules Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, u.FL connector Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C u.FL 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog Multiprotocol Modules Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, RF antenna pin Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C RF 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
Renesas / Dialog Multiprotocol Modules Wi-Fi4/BLE combo - Single band 2.4GHz, 802.11 b/g/n, 8Mbyte Flash, PCB trace antenna Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 b/g/n Reel
Renesas / Dialog Multiprotocol Modules Wi-Fi6/BLE combo - Single band 2.4GHz, 802.11 b/g/n/ax, 8Mbyte Flash, PCB trace antenna Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500

RRQ61051 160 MHz GPIO, I2C, I2S, SPI, UART 1.8 V 3.6 V - 40 C + 85 C PCB Antenna 20 mm x 15 mm x 3 mm Bluetooth 5.1 802.11 a/b/g/n/ax Reel
NXP Semiconductors Multiprotocol Modules IW611HN/A1C Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel
NXP Semiconductors Multiprotocol Modules IW612HN/A1C Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Tray
NXP Semiconductors Multiprotocol Modules IW612HN/A1C Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel
NXP Semiconductors Multiprotocol Modules IW612HN/A1I Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Tray
Digi Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, AT&T SIM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, Verizon SIM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, Verizon SIM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Texas Instruments Multiprotocol Modules SimpleLink dual-band (2.4GHz and 5GHz) W Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1
: 1,500
No
CC3351MOD 2.41 GHz to 2.47 GHz 18.3 dBm SPI - 40 C + 85 C 10.9 mm x 10.9 mm x 2.1 mm Bluetooth WiFi Reel, Cut Tape, MouseReel