+ 85 C Tray Sub-GHz Modules

Results: 52
Select Image Part # Mfr. Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Supply Current Transmitting Supply Current Receiving Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Sub GHz Packaging
LPRS Sub-GHz Modules LoRa Radio Trans Module 868MHz 28In Stock
50Expected 2026/11/19
Min.: 1
Mult.: 1

868.85 MHz, 915 MHz 17 dBm SDI, SDO 3.3 V 5.5 V 90 mA 10 mA - 40 C + 85 C u.FL 20.32 mm x 15.24 mm x 2 mm LoRa/LoRaWAN Tray


Microchip Technology Sub-GHz Modules Ultra-low power Long range LoRa module (863-928 MHz)
4,703Expected 2026/10/26
Min.: 1
Mult.: 1
863 MHz to 928 MHz 18.59 dBm SPI, USB 3.3 V 3.3 V 114.68 mA 13.36 mA - 40 C + 85 C u.FL 17 mm x 13.5 mm x 2.8 mm LoRa/LoRaWAN Tray

TE Connectivity / Linx Technologies Sub-GHz Modules HumAPRO Transceiver 900MHZ Cert, u.FL
924Expected 2026/11/16
Min.: 1
Mult.: 1

HumPRO 902 MHz to 928 MHz 25 dBm UART 2 V 3.6 V 380 mA 39 mA - 40 C + 85 C Castellation Line 16.66 mm x 25.70 mm x 2.90 mm Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), RF Pad, MMT, Japan
360Expected 2026/10/16
Min.: 1
Mult.: 1
900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 0.76 in x 0.534 in x 0.095 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), RF Pad, MMT, India
360Expected 2026/10/16
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 0.76 in x 0.534 in x 0.095 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), U.FL, MMT, North America
450Expected 2026/09/01
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 0.76 in x 0.534 in x 0.095 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), U.FL, MMT, Japan
450Expected 2026/10/16
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 0.76 in x 0.534 in x 0.095 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), U.FL, MMT, India
450Expected 2026/10/16
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 0.76 in x 0.534 in x 0.095 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), U.FL, SMT, North America
180Expected 2026/08/31
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.3 in x 0.866 in x 0.128 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 868 MHz, Full Function Node (FFN), Chip antenna, SMT, Europe
36Expected 2026/10/16
Min.: 1
Mult.: 1

868 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.3 in x 0.866 in x 0.128 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), Chip antenna, SMT, North America
36Expected 2026/10/16
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.3 in x 0.866 in x 0.128 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), RF Pad, SMT, North America
36Expected 2026/08/21
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.3 in x 0.866 in x 0.128 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 868 MHz, Full Function Node (FFN), RF Pad, SMT, Europe
36Expected 2026/10/16
Min.: 1
Mult.: 1

868 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.3 in x 0.866 in x 0.128 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 868 MHz, Full Function Node (FFN), U.FL, SMT, Europe
36Expected 2026/10/16
Min.: 1
Mult.: 1

868 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.3 in x 0.866 in x 0.128 in Tray
Digi Sub-GHz Modules Digi XBee for Wi-SUN - 900 MHz, Full Function Node (FFN), U.FL, Through-hole, North America
20Expected 2026/10/16
Min.: 1
Mult.: 1

900 MHz 2.4 V 3.8 V 195 mA 12.2 mA - 40 C + 85 C 1.088 in x 0.96 in x 0.271 in Tray
LPRS Sub-GHz Modules Euro/US 868/915MHz Int Cont Trans RFMod
97Expected 2026/09/14
Min.: 1
Mult.: 1

eRIC 868 MHz, 915 MHz - 3 dBm SDI, SDO 2.5 V 5.5 V 32 mA 15 mA - 40 C + 85 C External 20 mm x 15 mm x 2.2 mm ISM Tray
Silicon Labs Sub-GHz Modules Z-Wave 800 SiP Module, Secure Vault Mid, +14 dBm, Sub-GHz, 512 kB , -40 to 85 C, RF Pin Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

868 MHz, 915 MHz 14 dBm I2C, I2S, SPI, UART 1.8 V 3.8 V 30 mA 4.6 mA - 40 C + 85 C Pin 6.5 mm x 6.5 mm Sub GHz Tray

TE Connectivity / Linx Technologies Sub-GHz Modules Module HUM-PRC 868MHz FHSS FM XCVR Non-Stocked Lead-Time 32 Weeks
Min.: 640
Mult.: 128

HumPRC 863 MHz to 870 MHz 9.5 dBm UART 2 V 3.6 V 40.5 mA 23.5 mA - 40 C + 85 C 11.43 mm x 13.97 mm x 1.78 mm Tray

TE Connectivity / Linx Technologies Sub-GHz Modules Module HUM-PRC 868MHz FHSS FM XCVR EU Non-Stocked Lead-Time 32 Weeks
Min.: 256
Mult.: 256

HumPRC 863 MHz to 870 MHz 9.5 dBm UART 2 V 3.6 V 40.5 mA 23.5 mA - 40 C + 85 C 11.43 mm x 20.62 mm x 2.95 mm Tray

TE Connectivity / Linx Technologies Sub-GHz Modules HumPRO 868MHZ Transciever Module Non-Stocked Lead-Time 32 Weeks
Min.: 256
Mult.: 256

HumPRO 863 MHz to 870 MHz 9.5 dBm UART 2 V 3.6 V 40.5 mA 23.5 mA - 40 C + 85 C 11.43 mm x 14 mm x 1.78 mm Tray

TE Connectivity / Linx Technologies Sub-GHz Modules HumPRO 868MHZ FHSS u.FL Connector Non-Stocked Lead-Time 32 Weeks
Min.: 256
Mult.: 256

HumPRO 863 MHz to 870 MHz 9.5 dBm UART 2 V 3.6 V 40.5 mA 23.5 mA - 40 C + 85 C 11.43 mm x 20.57 mm x 3 mm Tray

Ezurio Sub-GHz Modules 900MHz OEM Transceiver, Pluggable, 3.3V TTL, 200mW, u.FL Jack Non-Stocked
Min.: 1
Mult.: 1

902 MHz to 928 MHz 200 mW UART 2 V 3.6 V 230 mA 30 mA + 85 C u.FL 25 mm x 30 mm x 4 mm Tray
Microchip Technology Sub-GHz Modules LoRa Transceiver Module 868MHz Non-Stocked Lead-Time 20 Weeks
Min.: 50
Mult.: 50
RN2483 433.05 MHz to 434.79 MHz, 863 MHz to 870 MHz 14 dBm UART 2.1 V 3.6 V 38.9 mA - 40 C + 85 C 17.8 mm x 26.7 mm x 3.34 mm Tray
Silicon Labs Sub-GHz Modules Z-Wave 800 SiP Module, Secure Vault High, +14 dBm, Sub-GHz, 512 kB , -40 to 85 C, RF Pin Non-Stocked
Min.: 1,300
Mult.: 1,300

868 MHz, 915 MHz 14 dBm I2C 1.8 V 3.6 V 30 mA 5.1 mA - 40 C + 85 C Pin 6.5 mm x 6.5 mm Sub GHz Tray
TTM Technologies Sub-GHz Modules Non-Stocked Lead-Time 26 Weeks

A110LR09C 902 MHz to 928 MHz 10 dBm SPI 1.8 V 3.6 V 15 mA - 40 C + 85 C u.FL 9 mm x 12 mm x 2.5 mm LoRa/LoRaWAN Tray