CL03C180JA3GNNC

Samsung Electro-Mechanics
187-CL03C180JA3GNNC
CL03C180JA3GNNC

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 18pF+/-5% 25V C0G 06 0201

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
20 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 10000)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$0.16 $0.16
$0.058 $0.58
$0.033 $3.30
$0.021 $10.50
$0.016 $16.00
$0.01 $25.00
$0.009 $45.00
Full Reel (Order in multiples of 10000)
$0.006 $60.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
Samsung Electro-Mechanics
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
18 pF
25 VDC
C0G (NP0)
5 %
0201
0603
SMD/SMT
Standard
- 55 C
+ 125 C
0.6 mm (0.024 in)
0.3 mm (0.012 in)
0.33 mm (0.013 in)
General Type MLCCs
CL-Standard
Reel
Cut Tape
MouseReel
Brand: Samsung Electro-Mechanics
Class: Class 1
Package/Case: 0201 (0603 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 10000
Subcategory: Capacitors
Type: Multilayer Ceramic Capacitor
Part # Aliases: CL03C180JA3GNN
Unit Weight: 0.330 mg
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Attributes selected: 0

Datasheet

Models

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Compliance Codes
CNHTS:
8532241000
USHTS:
8532240020
JPHTS:
853224000
TARIC:
8532240000
BRHTS:
85322410
ECCN:
EAR99
Origin Classifications
Country of Origin:
Philippines
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

CL MLCC Standard Normal Capacitors

Samsung Electro-Mechanics CL MLCC Standard Normal Capacitors are broadly available chip-type capacitor that temporarily charges and remove noise in electric circuits. These standard normal capacitors offer various sizes and a wide range of capacities. The CL Multilayer Ceramic Capacitors (MLCC) provide a structural capacity to mount chips on a PCB at high speed. Typical applications include automotive, smartphones, PC, HDD/SSD boards, tablets, displays, game machines, and DC-DC converters.

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