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TSL1 Multilayer Ceramic Devices (Low Pass Type)
TAIYO YUDEN TSL1 Multilayer Ceramic Devices (Low Pass Type) feature a compact, low-profile package ideal for LTE, W-CDMA, CDMA, GSM, and Narrowband Internet of Things (NB-IoT) systems. These low pass type modules offer low loss, high attenuation, stable temperature characteristics, and a -40°C to +85°C or +90°C operating temperature range. Additional features include 0.15dB to 0.9dB insertion loss range, 50Ω input and output impedance, and two package sizes. TAIYO YUDEN TSL1 Multilayer Ceramic Devices (Low Pass Type) are suitable for reflow soldering, halogen free, and RoHS and REACH compliant. Typical applications include audio/visual (AV) equipment, office automation (OA) equipment, home appliances, information and communication equipment, and more.
