It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

HDTM-3-06-1-S-VT-5-R-1

Name: Samtec HDTM-3-06-1-S-VT-5-R-1
Brand: Samtec
SKU: 200-HDTM3061SVT5R1
Price: 11.03 USD
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser No:

200-HDTM3061SVT5R1

Mfr. No:

HDTM-3-06-1-S-VT-5-R-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-06-1-S-VT-5-R-1 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Samtec HDTM-3-06-1-S-VT-5-R-1

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Series:	HDTM
Packaging:	Tray
Brand:	Samtec
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	48
Subcategory:	Backplane Connectors

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

HDTM-3-06-1-S-VT-5-R-1 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

Compliance Codes

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.