THERM-A-GAP® Conductive, Cure-In-Place Compound

Parker Chomerics THERM-A-GAP® Conductive, Cure-in-Place (CIP) Compounds are two-component compounds that conform to irregular shapes and are vibration-dampening. No pre-mixing or weighing of components is required when using CIP 35 and CIP 60 compounds. The CIP 35 series features dispensable cure-in-place gap filling, potting, sealing, and encapsulating with a 55 Shore A hardness. The CIP 60 compound offers excellent thermal performance with 6.0W/m-K typical thermal conductivity and 50 Shore 00 hardness at full cure. Parker Chomerics THERM-A-GAP Conductive CIP Compounds are ideal for automotive, energy storage, power electronics, and telecommunications infrastructure applications.

Results: 5
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Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Thermal Conductivity
Color
Minimum Operating Temperature
Maximum Operating Temperature
Flammability Rating
Series
Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 45CC Kit
Datasheet
15In Stock
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Silicone Compound, 2 Part 2.5W/m-K Green - 55 C + 200 C UL 94 V-0 CIP35
Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 200CC Kit
Datasheet
12Expected 2026/08/27
Min.: 1
Mult.: 1

CIP35
Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 6W/m-K, 45cc Kit, THERM-A-GAP CIP 60
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 1
Mult.: 1
CIP 60
Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 6W/m-K, 200cc Kit, THERM-A-GAP CIP 60
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 1
Mult.: 1
CIP 60
Parker Chomerics Thermal Interface Products Thermal Conductive Cure-In-Place Compound, 6W/m-K, 400cc Kit, THERM-A-GAP CIP 60
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 14
Mult.: 1
CIP 60