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SFEM256GB2ED1TB-A-VG-111-STD

Name: Swissbit SFEM256GB2ED1TB-A-VG-111-STD
Brand: Swissbit
SKU: 922-608887
Price: 597.82 USD
Availability: Discontinued

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Mouser No:

922-608887

Mfr. No:

SFEM256GB2ED1TB-A-VG-111-STD

Mfr.:

Swissbit

Description:

eMMC Industrial Embedded MMC, EM-30 (153-b), 256 GB, 3D TLC Flash, -40C to +105C

Lifecycle:

NRND:

Not recommended for new designs.

Datasheet:

SFEM256GB2ED1TB-A-VG-111-STD Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Swissbit SFEM256GB2ED1TB-A-VG-111-STD

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Swissbit
Product Category:	eMMC
RoHS:
Series:	EM-30
Package/Case:	BGA-153
Brand:	Swissbit
Moisture Sensitive:	Yes
Product Type:	eMMC
Factory Pack Quantity:	1
Subcategory:	Memory & Data Storage
Part # Aliases:	608887

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Datasheet

SFEM256GB2ED1TB-A-VG-111-STD Datasheet (PDF)

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Compliance Codes

CNHTS:: 8542329090
CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: EAR99

Origin Classifications

Country of Origin:: Germany
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

EM-30 Series eMMC Memory Devices

Swissbit EM-30 Series eMMC Memory Devices are robust, reliable, and cost-efficient memory solution for embedded applications. These memory devices are fully compliant with JEDEC e·MMC 5.1 Standard (JESD84-B51) and come in 4GB to 256GB device density with multiple partitions in 3D TLC. The EM-30 eMMC memory devices feature a BGA package that is optimized for the most demanding industrial and automotive applications. These memory devices offer solder down form factor for embedded systems delivering performance known from large SSDs at a 3D TLC NAND price point. The 3D TLC NAND price point combined with a smart set of features supporting long-lasting data integrity and reduced total cost of ownership. Typical applications include embedded systems, automotive, EV charging, POS/POI terminals, factory/industrial automation, routers and switches, medical systems, and Internet of Things (IoT).