EPC EPC33110 3-Phase ePower™ Stage IC
Efficient Power Conversion (EPC) EPC33110 3-Phase ePower™ Stage Integrated Circuit (IC) is co-packaged with integrated gate drivers, level shifters, and bootstraps for compact, high-power-density motor control. The EPC33110 features an absolute maximum input voltage of 100V, a continuous power-stage load current of 20A, and 3.3V/5V logic levels. The module uses EPC's proprietary GaN® IC technology, resulting in a power-stage IC that translates logic-level control signals into a high-voltage and high-current power stage. This process makes it simpler to design, easier to manufacture, and smaller in size - all while being more efficient to operate. EPC EPC33110 3-Phase ePower Stage IC comes in a 6.5mm x 6mm thermally enhanced QFN package with an exposed top for low thermal resistance to top-side heatsinking and wettable flanks for inline automated optical inspection (AOI).
Features
- 3-phase integrated power module
- Each phase integrates high-side and low-side eGaN® FET with internal gate driver and level shifter
- Independent high-side and low-side control inputs for all phases
- Logic lockout commands both FETs off when inputs are both high at same time
- Synchronous charging for high-side bootstrap supplies
- Robust level shifter operation for hard and soft switching conditions
- Standby function for low quiescent current mode
- Fast PWM shutdown when (SD/STB) pulled low
- Power-on-reset for low-side and high-side power supplies
- Power stage high impedance guaranteed in absence of VDRV/VBOOT supplies
- 0% and 100% duty capable
Applications
- Motor drive inverters (BLDC/PMSM)
- Humanoid and collaborative robots (elbow/wrist/ankle joints)
- Miniature motors for industrial automation
- Small-payload drones and gimbals
Specifications
- 20A continuous power stage load current TJ = +25°C
- 3MHz maximum operating PWM frequency
- 100V absolute maximum input voltage
- 80V operating input voltage range
- 5V nominal bias supply voltage
- 11.7mΩ + 13mΩ typical RDS(on)
- 3.3V/5V logic levels
- Thermally enhanced QFN package with exposed top for low thermal resistance to top-side heatsinking, wettable flanks for inline AOI
- 6.5mm x 6mm package size
Typical Application
