New Thermal Interface Products
Qnity Tgard™ 6000 Electrically Insulating Thermal Interface Material (TIM) combines a polyimide film dielectric layer with a thermally conductive silicone coating. This construction provides a compliant interface while ensuring effective thermal performance under low clamping pressure. Additional features include high dielectric strength, excellent electrical insulation, and strong resistance to tears and punctures for reliable operation in demanding environments. Qnity Tgard 6000 TIM products are available in both adhesive-backed and non-adhesive versions. Both types are designed for easy installation and can be integrated into user-specific assembly processes as required. The Tgard 6000 series is ideal for automotive systems, power electronics, and other applications requiring durable, long-term performance.
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Qnity Tgard™ 6000 Electrically Insulating MaterialCombines a polyimide film dielectric layer with a thermally conductive silicone coating.10/27/2026
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Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs®Support 20% to 50% compressibility with reworkable and pick-and-place functionality.10/13/2026 -
StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.4/8/2026 -
Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.2/2/2026 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.11/6/2025 -
Qnity Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.9/9/2025 -
Qnity Tputty™ SF560 1-Part Dispensable Gap FillersOffers thermal conductivity of 5.6W/mK, along with superior thermal resistance.8/25/2025 -
Wakefield Thermal CD ulTIMiFlux™ Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces7/23/2025 -
Wakefield Thermal WTC/WTI Omnipad Thermal InsulatorsHighly efficient and designed for semiconductor-to-heat sink interfaces.7/23/2025 -
Qnity Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.10/25/2024 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.5/30/2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.5/27/2024 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.1/18/2024 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.10/30/2023 -
LeaderTech TCF Ultra-Thin Carbon Fibre Thermal PadsLow thermal resistance, soft surface, and mainly uses carbon fibre as a thermally conductive filler.10/18/2023 -
LeaderTech TGN Ultra-Thin Thermal PadsFeatures low thermal resistance and is manufactured by combining graphene and silicone.10/18/2023 -
LeaderTech TCI Composite Indium SheetTransitions from solid to liquid at its melting point and back to solid again at room temperature.10/18/2023 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.9/27/2023 -
Qnity CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.9/8/2023 -
Bergquist Company Data Centre ApplicationsAdvanced materials help with thermal management, long-term reliability, and stress protection.4/1/2023