Vishay Semiconductors EMIPAK PressFit Power Modules
Vishay Semiconductors EMIPAK PressFit Power Modules are designed to facilitate a reliable performance in rugged 15A to 150A applications. Higher power density is achieved via integrated power components into a single housing. Several configurations of various die selections are available. Additionally, the EMIPAK modules include an integrated thermal sensor.
The Vishay Semiconductors EMIPAK PressFit Power Modules come in a 1B package with PressFit pins for ease of use. An exposed substrate and optimized layout on the package help to minimize stray parameters allowing improved performance.
Features
- E series power MOSFET with fast body diode
- SiC diode technology
- Exposed Al2O3 substrate with low thermal resistance
- Low input capacitance
- Low switching and conduction losses
- Low figure-of-merit (FOM) Ron x Qg
- Ultra-low gate charge Qg
- Low internal inductances
- Qualified using AQG324 guideline as reference
Additional Resources
Package Overview
Published: 2022-09-13
| Updated: 2025-10-23