87760-2618

Name: Molex 87760-2618
Brand: Molex
SKU: 538-87760-2618
Price: 1.03 USD
Availability: OutOfStock

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Mouser No:

538-87760-2618

Mfr. No:

87760-2618

Mfr.:

Molex

Description:

Headers & Wire Housings 2mm Pit. Milli-Grid Header, R/A, TH, 26 Pos., 2.54 m Tin (Sn) Pltg, Mating Pin Lg. 4mm, Tail Lg. 2.6mm, Tray, Lead-Free

Datasheet:

87760-2618 Datasheet

ECAD Model:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Pin Strip
Number of Positions:	26 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	2 Row
Mounting Style:	Through Hole
Termination Style:	Solder Pin
Mounting Angle:	Right Angle
Contact Plating:	Tin
Series:	87760
Tradename:	Milli-Grid
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Brand:	Molex
Contact Material:	Phosphor Bronze
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Material:	Thermoplastic (TP)
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	2400
Subcategory:	Headers & Wire Housings
Voltage Rating:	125 V
Part # Aliases:	0877602618 877602618
Unit Weight:	1.003 g

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Datasheet

87760-2618 Datasheet

Models

RoHS Certificate (PDF)

Compliance Codes

USHTS:: 8536694040
ECCN:: EAR99

Origin Classifications

Country of Origin:: Indonesia
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Fit Family Connectors

Molex Fit Dual-Row Connectors provide a scalable power connectivity platform for wire-to-wire, wire-to-board, and board-to-board applications. Spanning Nano-Fit™, Micro-Fit™, Ultra-Fit™, Mini-Fit™, and Mega-Fit™ connector systems, these Molex series address a range of design challenges, from space-constrained devices to power-intensive equipment. Built-in features such as polarization, color coding, and keying help improve assembly efficiency and reduce the risk of mis-mating, while an optimized balance of connector size, current capacity, and reliability enables consistent performance across diverse applications.