-ar Multiprotocol Modules

Results: 197
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Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Silex Technology Multiprotocol Modules Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
Datasheet
Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
Reel: 500

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant.2+32GB - Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant. 8+64GB - Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 3,000
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant. 1+8GB - Industrial temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules No connectivity. 4+32GB - Industrial temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant.2+16GB - Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 3,000
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant.4+32GB - Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant. 1+8GB - Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi /BT variant. 2+16GB - Industrial temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz ADC, GPIO, I2C, PWM, UART 3 V 3.6 V - 40 C + 85 C 24 mm x 16 mm x 2.6 mm Bluetooth 5.2 802.11 b/g/n
Quectel Multiprotocol Modules No connectivity. 4+32GB variant. Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel Multiprotocol Modules No connectivity. 1+8GB - Industrial temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS
Quectel Multiprotocol Modules No connectivity. 2+32GB variant. Consumer temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40-105C, 4MB flash Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1
Reel: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac
Quectel Multiprotocol Modules No connectivity. 2+16GB - Industrial temperature range
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 600
Mult.: 200
Reel: 200
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.3 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA 2S), 2MB Flash, -40 85C
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 500
Mult.: 500
Reel: 500

2.4 GHz ADC, GPIO, PWM, UART 3 V 3.6 V - 40 C + 85 C 17.91 mm x 14.99 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40-85C, 2MB flash Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1
Reel: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA 2S), 4MB Flash, -40 85C
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 500
Mult.: 500
Reel: 500

2.4 GHz ADC, GPIO, PWM, UART 3 V 3.6 V - 40 C + 85 C 17.91 mm x 14.99 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel Multiprotocol Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA LC9), 4MB Flash, Ceramic antenna, -40 105C Non-Stocked Lead-Time 12 Weeks
Min.: 500
Mult.: 500
Reel: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n Reel