Teseo-LIV3F GNSS Prototyping Solution

STMicroelectronics Teseo-LIV3F GNSS Prototyping Solution combines the Nucleo-F401 and X-Nucleo-GNSS1A1 board with related STM32 firmware (X-CUBE-GNSS1). Easily prototype every position awareness application using the Teseo-LIV3F. This solution is the Teseo-LIV3F's standard prototyping platform for hobbyists and professionals. The backbone of the STMicroelectronics Teseo-LIV3F GNSS Prototyping Solution is the Teseo-LIV3F GNSS modules and the STM32F401RE 32-bit MCU.

Results: 3
Select Image Part # Mfr. Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Mounting Style Package/Case Core Program Memory Size Data Bus Width ADC Resolution Maximum Clock Frequency Number of I/Os Data RAM Size Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
STMicroelectronics ARM Microcontrollers - MCU STM32 Dynamic Efficiency MCU, Arm Cortex-M4 core DSP & FPU, up to 512 Kbytes of 7,756In Stock
Min.: 1
Mult.: 1

STM32F401RE SMD/SMT LQFP-64 ARM Cortex M4 512 kB 32 bit 12 bit 84 MHz 50 I/O 96 kB 1.7 V 3.6 V - 40 C + 85 C Tray
STMicroelectronics ARM Microcontrollers - MCU STM32 Dynamic Efficiency MCU, Arm Cortex-M4 core DSP & FPU, up to 512 Kbytes of 2,553In Stock
Min.: 1
Mult.: 1
Reel: 1,000

STM32F401RE SMD/SMT LQFP-64 ARM Cortex M4 512 kB 32 bit 12 bit 84 MHz 50 I/O 96 kB 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
STMicroelectronics ARM Microcontrollers - MCU STM32 Dynamic Efficiency MCU, Arm Cortex-M4 core DSP & FPU, up to 512 Kbytes of 505In Stock
Min.: 1
Mult.: 1

STM32F401RE SMD/SMT LQFP-64 ARM Cortex M4 512 kB 32 bit 12 bit 84 MHz 50 I/O 96 kB 1.7 V 3.6 V - 40 C + 105 C Tray