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Bench Talk for Design Engineers

Bench Talk

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Bench Talk for Design Engineers | The Official Blog of Mouser Electronics


Beyond Moore’s Law: How Algorithms, Data Movement, and Co-Design Drive Performance
On October 1, 2026 in Computing, Dev Tools, EIT 2026, Power, Wide Bandgap by
The next era of computing relies on smarter algorithms, optimized data movement, and hardware-software co-design to deliver greater efficiency and performance.
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371 Views
Tagged With: algorithms, chiplets, data movement, energy efficiency, gpus, hardware-software co-design, moore's law, parallel computing
Modular Building Blocks Help Scale High‑Voltage Power Systems
On September 29, 2026 in Automotive, Computing, Industrial, Power, Wide Bandgap by Microchip Technology
Microchip Technology
Modular 3.3kV SiC power modules simplify scalable medium-voltage systems for traction auxiliaries, solid-state transformers, and ultrafast chargers.
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442 Views
Tagged With: 3.3kv sic power modules, dc-link voltage, medium-voltage systems, soft switching, solid-state transformers, traction auxiliary systems, ultrafast chargers
New Tech Tuesdays: How Silicon Carbide Enables Motor-Integrated Servo Drives
On September 15, 2026 in All, Industrial, Motor Control, New Tech Tuesdays, Wide Bandgap by
SiC power stages enable compact motor-integrated servo drives and three-phase inverter evaluation for robotics and industrial motion control.
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486 Views
Tagged With: controller interfacing, inverter, ref-smd5kimsqm2inv power board, servo drive, sic, silicon carbide
Engineering Electronics That Survive Orbit
On June 10, 2026 in All, Power, Quality, Wide Bandgap by SJ Barak
SJ Barak
Explore how radiation affects space electronics, including single-event upset, latch-up, and total ionizing dose, and how engineers design rad-hard and rad-tolerant systems.
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835 Views
Tagged With: gan sic power, rad-hard components, radiation-hardened electronics, satellite electronics design, single event upset, soi technology, space radiation effects, space-grade semiconductors, total ionizing dose
How SiC Is Enabling Next Generation Automotive Power Electronics
On May 20, 2026 in Automotive, Power, Wide Bandgap by onsemi
onsemi
Explore how silicon carbide boosts EV on-board chargers with higher switching frequency, lower losses, 800V/1200V modules, T2PAK cooling, and bidirectional V2H.
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899 Views
Tagged With: 1200v power module, 800v ev architecture, bidirectional charging v2h, bridgeless pfc, isolated gate driver, llc resonant converter, obc power stage, on-board charger, sic mosfet, t2pak top-side cooling
Why TOLL-8N Is Gaining Momentum in High-Power, High-Density Designs
On May 18, 2026 in Power, Wide Bandgap by ROHM Semiconductor
ROHM Semiconductor
Packaging plays a critical role in 650V GaN FET performance. Learn how TOLL-8N packages reduce parasitics and improve thermal efficiency in high-speed power designs.
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3925 Views
Tagged With: 650v gan fet, gan power transistors, high voltage power design, kelvin source, low inductance packaging, power electronics packaging, thermal resistance, toll-8n package, wide bandgap semiconductors
Powering Lanthanide Nanoparticles for NIR II LEDs and Photonics
On May 15, 2026 in Power, Sensors, Wide Bandgap by SJ Barak
SJ Barak
Electrically powering lanthanide nanoparticles enables ultra-narrow NIR II light sources for medical imaging, optical communications, and next gen photonic devices.
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877 Views
Tagged With: lanthanide nanoparticles, lnleds, medical imaging nanoparticles, near infrared photonics, nir-ii leds, optical communications, photonic devices, triplet state energy transfer
A Tiny Component with a Large Impact on EV Charging
On April 30, 2026 in Automotive, Power, Wide Bandgap by TDK
TDK
Discover how pulse transformers improve PLC signal integrity and isolation in EV charging control circuits, enabling reliable CCS and NACS communication in compact, high-power chargers.
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2147 Views
Tagged With: ccs charging, control pilot communication, ev charger control circuits, ev charging plc, galvanic isolation, homeplug green phy (hpgp), nacs charging, pulse transformer, signal integrity, tdk amt45s
Mitigating Growing EMI Challenges from High-Efficiency Power Systems
On March 23, 2026 in All, Circuit Protection, Connectors, Industrial, Motor Control, Power, Sensors, Wide Bandgap by TE Connectivity
TE Connectivity
High-efficiency SiC and GaN power systems increase conducted EMI. Learn how system design, parasitics, and TE Connectivity/Schaffner filtering solutions mitigate EMI in industrial power applications.
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904 Views
Tagged With: conducted emi, emc compliance, emi mitigation, gan power devices, industrial power filters, power electronics design, sic power devices, three-phase emi filters, variable-speed drives, wide-bandgap systems
New Tech Tuesdays: Radiation-Hard GaN RF Advances LEO Satellite Connectivity Performance
On March 17, 2026 in All, New Tech Tuesdays, Power, RF, Wide Bandgap, Wireless by Darshan Mulki
Darshan Mulki
Radiation-hardened GaN RF technology boosts LEO satellite performance with high efficiency, reliable 5G/6G links, and robust power management for space-grade communication systems.
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1017 Views
Tagged With: 5g satellite links, 6g connectivity, gan rf amplifiers, leo satellites, radiation-hardened power, rf power systems, satellite power management, space-grade gan, tid immunity, wide bandgap devices

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