TE Connectivity Thermal Bridge Technology for I/O Applications

TE Connectivity's (TE) Thermal Bridge Technology for Input/Output (I/O) Applications is a mechanical alternative to traditional gap pads or thermal interface materials. Thermal Bridge Technology offers superior thermal resistance while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features improved thermal resistance, better reliability and durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/wireless, servers, Ethernet SP routing, and high-performance computing (HPC) applications.