Wakefield Thermal GL ulTIMiFlux™ High-Performance Thermal Gels
Wakefield Thermal GL ulTIMiFlux™ High-Performance Thermal Gels are fully-cured, dispensable gels with low thermal impedance and low compressive force deflection. Wakefield Thermal GL ulTIMiFlux™ High-Performance Thermal Gels feature an 8g/min to 60g/min flow rate, 1.20 to 3.20 specific gravity, and 2.4W/mK to 3.5W/mK thermal conductivity. The thermal gels are designed for power supply, flat panel display, power module, and microprocessor applications.
Features
- Fully-cured dispensable gels
- Low thermal impedance
- Heat spreader use
- Temperature cycling reliability
- Shock and vibration reliability
- Low compressive force deflection
- No refrigeration, mixing, or additional curing required
- No settling in storage
- Ideal for multiple thickness gaps
Applications
- Automotive electronic control units (ECUs)
- Power supplies and semiconductors
- Memory and power modules
- Microprocessors and graphics processors
- Flat panel displays
Specifications
- 10CC syringe size
- 8g/min to 60g/min flow rate
- 1.20 to 3.20 specific gravity
- 0.002in to 0.015in minimum bondline thickness
- 2.4W/mK to 3.5W/mK thermal conductivity
Dispensable Thermal Gel Packaging
Thermal Gel Application on Electronic Components
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